Gigabyte’s GA-E350N-USB3 of SAPPHIRE Technology

This is the first AMD Fusion’s accelerated processing unit which is codenamed “Bobcat”.  This is conceived by SAPPHIRE Technology, the world’s largest manufacturer and supplier of graphics systems based on technology from AMD. Introducing the Gigabyte’s GA-E350N-USB3 board integrates the E-350 APU onto the actual PCB itself. This is because there is simply no socket option available from AMD.

Gigabyte GA E350N USB3

Gigabyte GA-E350N-USB3

It is a mini-ITX motherboard. Its board has the traditional blue brushed style although the heatsink is deep silver. This device passively cools the board, but many users don’t understand that passive fins still need space to form a convection cycle in order to cool correctly. Unlike other models, the heatsink is screwed down properly, without push-pins. The motherboard’s layout is generally neat, but the SATA ports might be quite difficult to access from behind the PCI-E slot. It also has a Gigabit Ethernet connection, and 7.1 surround sound with an S/PDIF output making it a great choice for a home theatre system.

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The Rise of the New Intel Processor – Pentium G6960

Sandy Bridge Processors is the second generation of i Core processors developed my Intel.  It is intended to increase performance while maintaining its core transistor. It has an updated security system with commands transmitted through 3G or an internet connection. Now, it has released its latest model – Pentium G6960.

Intel Sandy Bridge Pentium G6960

Intel Sandy Bridge Pentium G6960

Pentium G6960 according to Intel is an enhanced micro-architecture of Westmere which uses the 32nm manufacturing process. It has a dimension of 1.48 by 1.48 inch with part number CM80616005373AA and S-Spec number of SLBT-6. It features a dual Clarkdale core chip clocked at 2.93GHz. It will have a shared 3MB of L3 cache system and an integrated DDR3 SDRAM memory controller.  It works for socket 1156 motherboards and can support DDR3 – 1066 memory.

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LG’s Readiness for Introducing Optimus 3D & 3D tablet at MWC 2011

It has been learned from the account of a leaked slide revealing 3D- Capable Version achieved through Tegra 2 is heading for mass production. As a pre-launch activity LG has gone ahead in registering the website domain lgoptimus.3d.nl, for which no formal announcement has been done. Even in spite of silence maintained so far, one can see LG Optimus 3D popping up at Dutch the Phone House Web. Followed by this is invitation to LGMWC press conference titled “Into the New Dimension”.

LG Optimus 3D Android phone

At the CES 2011 event LG showcased a 4.3″ 3D Mobile Display with a promise of “Getting to see these Features on a functional Handset very soon, rather earlier than expected.

GSMpedia quite unexpectedly had a chance of picking a placeholder meant for a phone indicating to be of Optimus 3D at the Phonehouse web, which revealed further regarding Benelux branch of LG having registered the domain  of lgoptimus3d.nl. in the same manner as it was done for lgoptimus2x.nl, just short time before Optimus 2X was officially introduced in the market.

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Huawei IDEOS X5 US Version Phone Availability Likely by Mid 2011

Huawei made an announcement in respect of US market Model related to IDEOS X5, which is middle range Android smartphone. The device is using the same formula as of IDEOS (Original), alternatively known as Comet for T-Mobile and the objective is making available excellent product with competitive pricing range.

Huawei IDEOS X5

Huawei IDEOS X5

The specifications of the phone are already known the attempt is to learn more information from user’s point of view. The phone is superb in elegance accompanied by sturdy built up equipped with 3.8-inch capacitive display function covered by glass in front. There is 1500mAh battery located at back with cover of soft-touch plastics; the entire phone mechanism is enclosed in 11.4 mm thin body.

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